It missed a few important details or nits:
America makes the lasers that zap the tin droplets that make the EUV light, 1-2 low energy pulses to optimally shape them, then a big one to ionize the tin atoms. Base system fires 50,000 a second, the laser system hits about 70-80% of them.
In the vacuum this all has to all be in, where does that tin go? Hydrogen atoms wafting through do a lot of it, but the first mirror in the system has to be replaced every year. Which the PRC isn't getting.
Before this, and still, ASML started making the world's best DUV steppers, I read they integrate better with the rest of your factory than Canon or Nikon's, which you'd expect from the Japanese. One of which didn't even master immersion lithography, putting water between the mask and the silicon wafer ("193i").
We could still make plenty of really good chips without EUV lithography, though. It's just cheaper and for mobile with its battery limits best to use it, if your name is TSMC. They're also starting to be used for DRAM.
Forget about the surface US Navy, we don't have the logistics to fight the PRC over Taiwan, per Konrad we don't even have the fuel to evacuate all our people in East Asia (the Hawaii depot was closed without replacement, of course). Dealing with our attack subs wouldn't be fun, though.
Sinistra delenda est.
npub13r…m3jlt
2026-09-08 04:15:23 UTC
in reply to nevent1q…yrhj
Author Public Key
npub13rp7r4aglr7nlktkj0k4y3m2trxv0ulphu4pm7qv3w0vwnvzntjsvm3jltSeen on
wss://relay.momostr.pinkPublished at
2026-09-08 04:15:23 UTCEvent JSON
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"content": "It missed a few important details or nits:\r\n\r\nAmerica makes the lasers that zap the tin droplets that make the EUV light, 1-2 low energy pulses to optimally shape them, then a big one to ionize the tin atoms. Base system fires 50,000 a second, the laser system hits about 70-80% of them.\r\n\r\nIn the vacuum this all has to all be in, where does that tin go? Hydrogen atoms wafting through do a lot of it, but the first mirror in the system has to be replaced every year. Which the PRC isn't getting.\r\n\r\nBefore this, and still, ASML started making the world's best DUV steppers, I read they integrate better with the rest of your factory than Canon or Nikon's, which you'd expect from the Japanese. One of which didn't even master immersion lithography, putting water between the mask and the silicon wafer (\"193i\").\r\n\r\nWe could still make plenty of really good chips without EUV lithography, though. It's just cheaper and for mobile with its battery limits best to use it, if your name is TSMC. They're also starting to be used for DRAM.\r\n\r\nForget about the surface US Navy, we don't have the logistics to fight the PRC over Taiwan, per Konrad we don't even have the fuel to evacuate all our people in East Asia (the Hawaii depot was closed without replacement, of course). Dealing with our attack subs wouldn't be fun, though.",
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