> "I fully expect all electronics to be dead at 100℃ if not actively igniting"
Baking semiconductors at 100 ℃ for several hours is in fact a mandatory practice to prevent damage during reflow soldering for ICs with a high [Moisture Sensitivity Level](https://en.wikipedia.org/wiki/Moisture_sensitivity_level) rating.
> For example, an end user of a SOT-223, MSL 3 package (1.8 mm thickness) that has been exposed to typical ambient air conditions for 72 hours longer than its floor life (168 hours) would need to perform a 27-hour bake at 120 °C
The real problem is other plastic parts (IC packages are fine) and the electrolytic capacitors. But if a circuit board is fully solid state, it will definitely survive a 100 °C bake. The data in the NAND is questionable, though.